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  product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays . 1/ 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 tsz22111 ? 14 ? 001 www.rohm.com system motor driver for cd/dvd player 4 ch system motor driver for car audio bd8266efv -m general description bd8266efv - m is btl driver of 5 inputs and 4 outputs f or car cds developed for s pindle motor (ch1) , sled / loading motor (ch2) and coil drive for actuator (ch3:traking ch4:focus) . it can drive motor and coil of the cd/ dvd drive. features ? drive at powvcc=5v and 8v with wid e maximum output amplitude . ? switches sled/loading input by cnt terminal . ? incorporates mute function by cnt terminal and mute ter minal. ? preventing the overcurrent to the load by the focus o ver c urrent p rotection (ocp) function. ? built - in tsd , uvlo . ? powv cc 1 and p owvcc2 are independent, and an efficient drive is possible. powv cc1 : for spindle & sled / loading . powvcc2 : for traking & foc us. ? aec - q100 qualified applications ? car audio typical application circuit key specification s ? i nput voltage range: 4.5v to 10 .0 v ? operating temperature range -40 to +8 5 powvcc1=powvcc2= 8v , rl=8 ? maximum output amplitude ( ch1 ) 6.5v( t yp.) maximum output amplitude (ch2 ) 7.0v( t yp.) maximum output amplitude (ch3,ch4 ) 6.0v( t yp.) powvcc1=powvcc2= 5v , rl=8 ? maximum output amplitude ( ch1 ) 4.1v( t yp.) maximum output amplitude (ch2 ) 4.5v( t yp.) maximum output amplitude (ch3 , ch4 ) 3.8v( t yp.) package w ( t yp.) d( t yp.) h( m ax . ) hts sop - b24 7.80mm x 7.60mm x 1.00mm htssop - b24 fig ure 1 . typical application circuit 2 4 2 3 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 3 4 5 6 7 8 9 1 0 1 1 1 2 d s p b d 8 2 6 6 e f v - m s p i n d l e m o t o r c h 1 s l e d / l o a d i n g m o t o r c h 2 t r a c k i n g c o i l c h 3 f o c u s c o i l c h 4 p o w v c c 1 p o w g n d 1 v o 1 ( - ) v o 1 ( + ) v o 2 ( - ) v o 2 ( + ) v o 3 ( - ) v o 3 ( + ) v o 4 ( - ) v o 4 ( + ) p o w g n d 2 p o w v c c 2 i n 1 c n t i n 2 - 1 i n 2 - 2 b i a s i n 3 i n 4 m u t e p r e g n d p r t c v r e g p r t o u t datashee t
2 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? pin configuration (topview) ? pin descriptio n (top view) fig ure 2 . pi n configuration ? block diagra m fig ure 3 . block diagram no. signal function 1 p ow vcc1 ch1,2 power supply input 2 powgnd1 power gnd1 3 vo1( - ) driver ch1 negative output 4 vo1(+) driver ch1 positive output 5 vo2( - ) driver ch 2 negative output 6 vo 2(+) driver ch 2 positive output 7 vo3( - ) driver ch 3 negative output 8 vo3(+) driver ch 3 positive output 9 vo4( - ) driver ch 4 negative output 10 vo4(+) driver ch 4 positive output 11 powgnd2 power gnd2 12 p ow vcc2 ch3,4 power supply input 13 prtout outp ut overcurrent protection flag 14 vreg power out pu t for internal logic 15 prtc overcurrent protection function on time set ting 16 pregnd pre part gnd 17 mute mute 18 in4 ch4 (fc:focus) input 19 in3 ch3 (tk:tracking) input 20 bias bias input 21 in2 - 2 ch2 - 2 (ld:loading) input 22 in2 - 1 ch2 - 1 (sl:sled) input 23 cnt control input 24 in1 in1 (sp:spindle) input 24 23 22 21 20 19 18 17 16 15 14 13 1 2 3 4 5 6 7 8 9 10 11 12 powvcc 1 in 1 powgnd 1 vo 1 ( - ) vo 1 (+) vo 2 ( - ) vo 2 (+) vo 3 ( - ) vo 3 (+) vo 4 ( - ) vo 4 (+) powgnd 2 powvcc 2 cnt in 2 - 1 in 2 - 2 bias in 3 in 4 mute pregnd prtc vreg prtout p o w v c c 1 p o w g n d 1 c h 1 c h 4 c h 2 c h 3 m u t e c n t b i a s p o w v c c 1 c h 3 c h 4 b i a s c n t c h 2 - 1 c h 2 - 2 c h 1 m u t e p r e g n d v r e g p r e g n d r e g u l a t o r 2 4 2 3 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 3 4 5 6 7 8 9 1 0 1 1 1 2 p o w g n d 1 c h 1 ( s p i n d l e ) c h 2 ( s l e d / l o a d i n g ) c h 3 ( t r a c k i n g ) c h 4 ( f o c u s ) p o w g n d 2 p o w v c c 2 1 0 0 k 2 0 . 7 5 k 2 0 . 7 5 k 2 0 . 7 5 k 1 . 6 5 v 9 4 k 5 0 k 9 4 k 5 0 k p o w v c c 2 p o w g n d 2 p r t o u t u v l o b i a s d r o p m u t e t s d o c p p r t c l e v e l s h i f t l e v e l s h i f t l e v e l s h i f t l e v e l s h i f t 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 5 0 k 1 0 0 k 1 0 0 k
3 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? absolute maximum ratings (ta=25  ) parameters symbol value units power supply pow vcc1 p ow vcc2 15 v input terminal voltage 1 vin1 * 1 p ow vcc1 v input te rminal voltage 2 vin2 * 2 7 v output terminal voltage 1 vout1 * 3 p ow vcc1 v output terminal voltage 2 vout2 * 4 7 v power dissipation pd 1.1 * 5 w 4.0 * 6 operating temperature range topr - 40 to +85  storage temperature tstg - 55 to +150  junction tempera ture tjmax +150  * 1 vin1 application terminal C *7 please decide the power supply voltage after considering power dissipation .
4 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? electrical characteristics >& unle ss otherwise noted , ta=25  ,powvcc1=powvcc2=8v, bias=1.65v, rl=8 >' parameter symbol limits unit condition min. typ. max. quiescent c urrent iq >+ 1 6 40 ma at no - load, mute= high < driver> output offset (ch1,2) voof1 - 100 0 100 mv output offset (ch3 ,4) voof2 - 50 0 50 mv maximum output amplitude (ch1) vom1 5.8 6.5 >+ v ron(total)=1.7  ( t yp.) e quivalent maximum output amplitude (ch2) vom2 6.4 7.0 >+ v ron(total)=0.9  ( t yp.) e quivalent maximum output amplitude( ch3,4) vom34 5.3 6.0 >+ v ron(total)=2.5  ( t y p.) e quivalent closed loop gain (ch1,2) gv12 24.0 25.7 27.4 db closed loop gain (ch3,4) gv34 15.5 17.5 19.5 db input impedance (ch1,2) inrch1 2 15 2 0.75 27 k  input impedance (ch3,4) inrch3 4 38 50 62 k  mute low level voltage vml >+ >+ 0.5 v mute h igh level voltage vmh 2.0 >+ >+ v mute input current imute 32 52 74 ua mute=3.3v cnt low level voltage vcntl >+ >+ 0.5 v cnt high level voltage vcnth 2.0 >+ >+ v cnt input current icnt 32 52 74
5 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? electrical characteristics >& unless otherwise noted , ta=25  ,powvcc1=powvcc2=8v, bias=1.65v, rl=8 >' parameter symbol limits unit condition min. typ. max. < focus overcurrent protection function > prtc d efault v oltage vprtr ef >+ 0 0.3 v at no - load prtc protection detection voltage vprtdet 2.7 3.0 3.3 v prtc protection release voltage vprtoff 0.7 1.0 1.3 v prtout low output voltage vpol >+ 0.1 0.3 v prtout >8 3.3v , 33k
6 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? electrical characteristics >& unless otherwise noted , ta= - 40 to 85  ,powvcc1=powvcc2= 8v, bias=1.65v, rl=8 >' parameter symbol limits unit condition min. typ. max. quiescent c urrent iq >+ 1 6 44 ma at no - load, mute= high < driver> output offset (ch1,2) voof1 - 100 0 100 mv output offset (ch3,4) voof2 - 50 0 50 mv maximum output ampl itude (ch1) vom1 5. 5 6.5 >+ v ron(total)=1.7  ( t yp.) e quivalent maximum output amplitude (ch2) vom2 6. 4 7.0 >+ v ron(total)=0.9  ( t yp.) e quivalent maximum output amplitude( ch3,4) vom34 4.8 6.0 >+ v ron(total)=2.5  ( t yp.) e quivalent closed loop gain (ch1,2) gv 12 24.0 25.7 27.4 db closed loop gain (ch3,4) gv34 15.5 17.5 19.5 db input impedance (ch1,2) inrch1 2 11 20.75 29 k  input impedance (ch3,4) inrch3 4 34 50 66 k  mute low level voltage vml >+ >+ 0. 4 v mute=3.3v mute high level voltage vmh 2.0 >+ >+ v mute input current imute 22 52 108
7 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? electrical characteristics >& unless otherwise noted , ta= - 40 to 85  ,powvcc1=powvcc2=8v, bias=1.65v, rl=8 >' parameter symbol limits unit condition min. typ. max. < focus overcurrent protection function > prtc d efault v oltage vprtref >+ 0 0.3 v at no - load prtc pro tection detection voltage vprtdet 2. 5 3.0 3. 5 v prtc protection release voltage vprtoff 0. 5 1.0 1. 5 v prtout low output voltage vpol >+ 0.1 0. 4 v prtout >8 3.3v , 33k
8 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? typical performance curves vcc= 4.5 >| 10v mute=cnt=3.3v bias=1.65v in1 >| 4=open ta=25  figure 4. quiescent current vcc= 8v mute=cnt=3.3v bias=1.65v in4=1.9v ta= - 40 >| 85  prtc=1v vcc= 8v mute=cnt=3.3v bias=1.65v ta= - 40 >| 85  prtc=1v figure 5. ocp detection current figure 6. prtc sink current vcc= 8v mute=cnt=3.3v bias=1.65v in4=1.9v ta= - 40 >| 85  prtc =1v figure 7. ocp detection current 34 39 44 49 -60 -20 20 60 100 temperature [] prtc sink current : iptsink [a] 290 370 450 530 -60 -20 20 60 100 temperature [] ocp detection current : iocp [ma] 400 425 450 475 500 4 6 8 10 12 supply voltage :powvcc1,2 [v] ocp detection currnet : iocp [ma] 0 10 20 30 40 4 6 8 10 12 supply voltage :powvcc1,2 [v] quiescent current :iq [ma]
9 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? typical performance curves figure 8. ch1 closed loop gain vcc = 8v mute=cnt=3.3v bias=1.65v in1=1.65v >) 0.1v ta= - 40 >| 85  vcc= 8v mute= 3.3v cnt=0 v bias=1.65v in2 - 1=1.65v >) 0.1v ta= - 40 >| 85  vcc= 8v mu te=cnt=3.3v bias=1.65v in3=1.65v >) 0.1v ta= - 40 >| 85  vcc= 8v mute=cnt=3.3v bias=1.65v in4=1.65v >) 0.1v ta= - 40 >| 85  figure 9. ch2 closed loop gain figure 10. ch3 closed loop gain figure 11. ch4 closed loop gain 24 25 26 27 -60 -20 20 60 100 temperature [] ch2 input output gain [db] 15.5 16.5 17.5 18.5 19.5 -60 -20 20 60 100 temperature [] ch4 input output gain [db] 24 25 26 27 -60 -20 20 60 100 temperature [] ch1 input output gain [db] 15.5 16.5 17.5 18.5 19.5 -60 -20 20 60 100 temperature [] ch3 input output gain [db]
10 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? typical performance curves figure 12. ch1 output on resistance characteristic figure 13. ch2 output on resistance characteristic figure 14. ch3 output on resistance characteristic figure 15. ch4 output on resistance characteristic vcc= 8v ta= - 40 >| 85  mute=cnt=3.3v bias=1.65v in1=0v,3.3v io=500ma vcc= 8v ta= - 40 >| 85  mute=cnt=3.3v bias=1.65v in2=0v,3.3v io=500ma vcc= 8v ta= - 40 >| 85  mute=cnt=3 .3v bias=1.65v in4=0v,3.3v io=500ma vcc= 8v ta= - 40 >| 85  mute=cnt=3.3v bias=1.65v in3=0v,3.3v io=500ma 0.5 1.0 1.5 2.0 2.5 -60 -20 20 60 100 temperature [] ch1 output resistance [] 0.0 0.5 1.0 1.5 -60 -20 20 60 100 temperature [] ch2 output resistance [] 0.0 1.0 2.0 3.0 4.0 -60 -20 20 60 100 temperature [] ch4 output resistance [] 0.0 1.0 2.0 3.0 4.0 -60 -20 20 60 100 temperature [] ch3 output resistance []
11 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? typical perf ormance curves figure 16. vreg voltage figure 17. internal bias voltage vcc= 8v mute=cnt=3.3v bias=1.65v ta= - 40 >| 85  vcc= 8v mute=cnt=3.3v bias=1.65v ta= - 40 >| 85  vcc= 4.5 >| 10v mute=3.3v cnt=0v bias=1.65v in1,2 - 1=gnd in2 - 2,3,4=open ta=25  vcc= 4.5 >| 10v mute=3.3v cnt=3.3v bias=1.65v in1 >| 4=open ta=25  vcc= 4.5 >| 10v mute=3.3v cnt= 0v bias=1.65v in1,2 - 1,2 - 2=open in3,4=gnd ta=25  vcc= 4.5 >| 10v mute=3.3v cnt=3.3v bias=1.65v in1 >| 4=open ta=25  figu re 19. quiescent current at in1~4=open , circuit current at in3=in4=gnd figure 18. quiescent current at in1~4=open , circuit current at in1=in2 - 1=gnd 4.0 4.5 5.0 5.5 6.0 -60 -20 20 60 100 temperature [] vreg voltage: vreg [v] 0 10 20 30 40 4 6 8 10 12 supply voltage :powvcc1,2 [v] quiescent current :iq [ma] 1.0 1.3 1.5 1.8 2.0 -60 -20 20 60 100 temperature [] internal bias voltage: vbin [v] 0 10 20 30 40 4 6 8 10 12 supply voltage :powvcc1,2 [v] quiescent current :iq [ma]
12 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m 1 driver logic normally operation state input output *8* 9 mute cnt bias ch1(sp) ch2 - 1(sl) ch2 - 2(ld) ch3(tk) ch4(fc) 1 h h h active mute active active active 2 h l h active active mute active active 3 l h h mute mute active mute mute 4 l l h mute m ute mute mute mute 5 h h l mute mute active mute mute 6 h l l mute mute mute mute mute 7 l h l mute mute active mute mute 8 l l l hi - z hi - z hi - z hi - z hi - z driver logic o cp p rotect ed operat ion state input output *8*9 mute cnt bias ch1(sp) ch2 - 1(s l) ch2 - 2(ld) ch3(tk) ch4(fc) 9 h h h active mute active mute mute 10 h l h active active mute mute mute 11 l h h mute mute active mute mute 12 l l h mute mute mute mute mute 13 h h l mute mute active mute mute 14 h l l mute mute mute mute mute 15 l h l mute mute active mute mute 16 l l l hi - z hi - z hi - z hi - z hi - z driver logic uvlo,tsd p rotect ed operat ion state input output *8*9 mute cnt bias ch1(sp) ch2 - 1(sl) ch2 - 2(ld) ch3(tk) ch4(fc) 17 l l l hi - z hi - z hi - z hi - z hi - z 18 the ot h ers state mute mute mute mute mute * 8 mute
13 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m 5 it is a function to turn off the actuator output when detecting the f ocus (ch4) over current state more than s et time. when the load current that flows to focus (ch4) output nmos exceeds 470 ma ( t yp . ) , the current proportional to the load current value is charged to the capacitor. the time to protection is decided depending on the capacitor value connected with the terminal prtc. the default value of the terminal prtc is 0v ( t yp.). it protects with 3 .0 v ( t yp.). (please note that protection operates when the potential of 3 .0 v or more remains in the terminal prtc when the power supply starts, and the standby is relea sed. it is likely to protect when the power supply is started up in the slew rate of 1ms or less, and please start up the power supply in the slew rate of 1ms or more.)when the terminal prtc is 1.0v ( t yp.) or less, protection is released. please delete c o f the terminal prtc and short - circuited with gnd when the overcurrent function unused. fig ure 20 . ocp tim ing chart prtc prtout (output) ch3(traking)output ch4(f ocus )output > 3 .0 v h mute d r i v e c u r r e n t 4 7 0 m a ( t y p . ) t h r e s h o l d v o l t a g e = 3 . 0 v ( t y p . ) c u r r e n t o f c a p a c i t o r d i s c h a r g e v o l t a g e o f c a p a c i t o r d r i v e r a c t i v e m u t e a c t i v e a c t i v e p r o t e c t c i r c u i t p r t o u t p r t c c h a r g e 0 v ( t y p . ) o c p m u t e o f f o n o f f 1 . 0 v ( t y p . )
14 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m focus overcurrent protection circuit ( ocp ) setting figure 21 . ocp setting powvcc1=powvcc2=8v,ta=25  i s ink = 43 l oad current that begins to be detected i t as over current (thr eshold current) >8 i t >; 43 error detection flag output time t d etective >8 the charge is started to cprtc reaches 3 .0 v from 0v, and the time to becoming prtout = high . c prtc vrtdet >;>& i source - i sink >' t detective >& vrtdet >; 3.0v ( t yp. ) >' when assuming t d etective =0.5s, i o = 500 ma as an example mute release time t discharge : electricity is discharged from c prtc after it becomes prtout = high and time until the prt c voltage drops from 3 .0 v to 1 .0 v. i o i s o u r c e i s i n k p r t c ( * ) 3 . 0 v o r 1 . 0 v t k , f c m u t e p r t o u t m a t r i x c u r r e n t m i r r o r p o w v c c 2 c p r t c 3 . 3 v 3 3
15 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m 6 >, output amplitude c alcu la tion p) spindle , sled/loading ii ) focus , tacking figure 2 2 . spindle,sled/loading closed loop gain c alcu la tion figure 2 3 . focus, tracking closed loop gain c alcu la tion * p l e a s e c o n s i d e r c o m p o n e n t d i s p e r s i o n r 3 = 5 0 k 1 8 % r 4 = 9 4 k 1 8 % r 4 / r 3 = 1 . 8 8 2 . 5 % * b = 2 + 2 2 % , 2 - 1 9 % v i n b i a s v i n b i a s b i a s r i n i n r 1 = 2 0 . 7 5 k e x a m p l e r i n = 0 k e x a m p l e r i n = 0 k g a i n = v o v i n = 9 4 k 5 0 k 2 2 = 1 7 . 5 d b g a i n = v i n = 9 4 k r i n + 5 0 k 2 2 v o * p l e a s e c o n s i d e r c o m p o n e n t d i s p e r s i o n r 1 = 2 0 . 7 5 k 1 8 % r 2 = 1 0 0 k 1 8 % r 2 / r 1 = 4 . 8 2 2 . 5 % * a = 2 + 1 8 % , 2 - 1 6 %
16 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? typical application circuit fig ure 2 4 . typical application c ircuit example a channel example ch1 spindle ch2 sled/loading ch3 tracking ch4 focus a e xternal part list c omponent name component value p roduct name manufacturer c pvcc11 0.1 t r a c k i n g i n f o c u s i n s l e d i n l o a d i n g i n s p i n d l e i n m u t e 2 4 2 3 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 3 4 5 6 7 8 9 1 0 1 1 1 2 m m s p i n d l e i n 1 c n t i n 2 - 1 i n 2 - 2 b i a s i n 3 i n 4 m u t e p r e g n d p r t c v r e g p r t o u t p o w v c c 1 p o w g n d 1 v o 1 ( - ) v o 1 ( + ) v o 2 ( - ) v o 2 ( + ) v o 3 ( - ) v o 3 ( + ) v o 4 ( - ) v o 4 ( + ) p o w g n d 2 p o w v c c 2 b d 8 2 6 6 e f v - m s l e d / l o a d i n g c o n t r o l s l e d / l o a d i n g t r a c k i n g f o c u s c h 1 c h 2 c h 3 c h 4 c p v c c 1 1 c p v c c 1 2 c p v c c 2 1 r p r t o u t c v r e g c p r t c 3 . 3 v t h e b a c k e x p o s u r e h e a t r a d i a t i o n b o a r d p o w e r g n d p o w e r g n d p o w e r g n d p o w e r g n d p o w e r g n d p r e g n d p r e g n d p r e g n d p r e g n d c p v c c 2 2
17 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m figure 25. application c ircuit example : ch1,ch2 are u sed, and ch3,ch4 are not used figure 26. applica tion c ircuit example : ch1,ch2 are not u sed, and ch3,ch4 are used s l e d i n l o a d i n g i n s p i n d l e i n m u t e 2 4 2 3 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 3 4 5 6 7 8 9 1 0 1 1 1 2 m m s p i n d l e i n 1 c n t i n 2 - 1 i n 2 - 2 b i a s i n 3 i n 4 m u t e p r e g n d p r t c v r e g p r t o u t p o w v c c 1 p o w g n d 1 v o 1 ( - ) v o 1 ( + ) v o 2 ( - ) v o 2 ( + ) v o 3 ( - ) v o 3 ( + ) v o 4 ( - ) v o 4 ( + ) p o w g n d 2 p o w v c c 2 b d 8 2 6 6 e f v - m s l e d / l o a d i n g c o n t r o l s l e d / l o a d i n g c h 1 c h 2 c p v c c 1 1 c p v c c 1 2 o p e n c v r e g p o w e r g n d p o w e r g n d p o w e r g n d p o w e r g n d p r e g n d p r e g n d p r e g n d t h e b a c k e x p o s u r e h e a t r a d i a t i o n b o a r d o p e n o p e n o p e n o p e n t r a c k i n g i n f o c u s i n m u t e 2 4 2 3 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 3 4 5 6 7 8 9 1 0 1 1 1 2 i n 1 c n t i n 2 - 1 i n 2 - 2 b i a s i n 3 i n 4 m u t e p r e g n d p r t c v r e g p r t o u t p o w v c c 1 p o w g n d 1 v o 1 ( - ) v o 1 ( + ) v o 2 ( - ) v o 2 ( + ) v o 3 ( - ) v o 3 ( + ) v o 4 ( - ) v o 4 ( + ) p o w g n d 2 p o w v c c 2 b d 8 2 6 6 e f v - m t r a c k i n g f o c u s c h 3 c h 4 c p v c c 2 1 c p v c c 2 2 r p r t o u t c v r e g c p r t c 3 . 3 v p o w e r g n d p o w e r g n d p o w e r g n d p o w e r g n d p r e g n d p r e g n d p r e g n d p r e g n d t h e b a c k e x p o s u r e h e a t r a d i a t i o n b o a r d o p e n p r e g n d o p e n o p e n o p e n o p e n
18 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? power dissipation 70mm70mm1.6mm, occupied copper foil is less than 3%, glass epoxy substrate, the board and the back exposure heat radiation board part of package are connected with solder. board (1) : 1 layer board (copper foil 0mm 0mm) board (2 ) : 2 layer board (copper foil 15mm 15mm) board (3) : 2 layer board (copper foil 70mm 70mm) board (4) : 4 layer board (copper foil 70mm 70mm) board (1) : ja = 113.6 c/w : ja = 73.5 c/w : ja = 44.6 c/w : ja = 31.3
19 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? i/o e qui valence circuit d values is typical . 3 . v o 1 - 4 . v o 1 + 5 . v o 2 - 6 . v o 2 + 7 . v o 3 - 8 . v o 3 + 9 . v o 4 - 1 0 . v o 4 + 1 3 . p r t o u t 1 8 . i n 4 1 9 . i n 3 2 0 . b i a s 2 3 . c n t 1 4 . v r e g 1 5 . p r t c 1 7 . m u t e 5 0 k 5 0 k 2 0 . 7 5 k 5 0 k 5 0 k 2 0 k 4 7 k 2 2 3 1 2 k 1 0 0 k 1 0 k 1 k 5 0 k 5 0 k 5 0 k 2 k 5 p 5 0 k 2 5 0 k 5 0 k 2 k 5 p 5 0 k 2 5 0 k 5 0 k p i n 3 . 4 . 5 . 6 . p i n 1 p i n 2 p i n 1 4 p i n 7 . 8 . 9 . 1 0 p i n 1 2 p i n 1 1 p i n 1 4 p i n 1 4 p i n 1 3 p i n 2 p i n 1 1 p i n 1 6 p i n 1 6 p i n 1 4 p i n 1 p i n 1 6 p i n 1 p i n 1 6 p i n 1 p i n 1 6 p i n 1 6 p i n 1 4 p i n 1 4 p i n 1 6 p i n 1 p i n 1 6 p i n 1 6 p i n 1 6 p i n 2 2 p i n 2 4 p i n 2 3 p i n 1 6 p i n 1 p i n 2 0 p i n 1 7 p i n 1 8 p i n 1 9 p i n 1 6 p i n 1 6 p i n 1 6 2 5 0 k 2 0 0 1 0 2 0 0 p i n 1 5 p i n 1 6 p i n 1 6 p i n 1 4 2 0 . 7 5 k p i n 1 6 p i n 1 4 p i n 2 1 p i n 1 6 2 1 . i n 2 - 2 2 2 . i n 2 - 1 2 4 . i n 1
20 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? operational note 1) absolute maximum ratings we are careful enough for quality control about this ic. so, there is no problem under normal ope ration, excluding that it exceeds the absolute maximum ratings. however, this ic might be destroyed when the absolute maximum ratings, such as impressed voltages or the operating temperature range, is exceeded, and whether the destruction is short circuit mode or open circuit mode cannot be specified. please take into consideration the physical countermeasures for safety, such as fusing, if a particular mode that exceeds the absolute maximum rating is assumed. 2) reverse polarity connection connecting the power line to the ic in reverse polarity (from that recommended) will damage the part. please utilize the direction protection device as a diode in the supply line and motor coil line. power supply line 3) power supply line due to return of regenerative current by reverse electromotive force, using electrolytic and ceramic suppress filter capacitors (0.1f) close to the ic power input terminals ( 4) gnd line please keep the gnd line the lowest potential always, and check the gnd voltage when transient voltages are connected to the ic. 5 ) thermal design do not exceed the power dissipation (pd) of the package specification rating under actual operation, and please design enough temperature margins . this product has exposed the frame to the back side of the package, but please note that it is assumed to u se heat radiation efficiency by the heat radiation for this part. please take the heat radiation pattern on not only the surface of the substrate but also the back of the substrate widely. 6 ) short circuit mode between terminals and wrong mounting do no t mount the ic in the wrong direction and displacement, and be careful about the reverse - connection of the power connector. moreover, this ic might be destroyed when the dust short the terminals between them or gnd. 7 ) radiation strong electromagnetic r adiation can cause operation failures. 8) aso (area of safety operation) do not exceed the maximum aso and the absolute maximum ratings of the output driver. 9 ) tsd (thermal shut - down) the tsd is activated when the junction temperature (tj) exceeds 1 75  , and the output terminal is switched to open. this protection have 25 10) capacitor between output driver and gnd if a large capacitor is connected between the output driver and gnd, this ic might be destroyed when vcc becomes 0v or gnd, because the electric charge accumulated in the capacitor flows to the o utput driver. please set said capacitor to smaller than 0.1f. 11) inspection by the set circuit board the stress might hang to ic by connecting the capacitor to the terminal with low impedance. then, please discharge electricity in each and all process. moreover, when attaching or detaching from jig in the inspection process, please turn off the power before mounting the ic, and turn on after mounting the ic, and vice versa. in addition, please take into consideration the countermeasures for electrostati c damage, such as giving the earth in assembly process, transportation or preservation.
21 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m 12) input terminal this ic is a monolithic ic, and has p + isolation and p substrate for the element separation. therefore, a parasitic pn junc tion is firmed in this p - layer and n - layer of each element. for instance, the resistor or the transistor is connected to the terminal as shown in the figure below. when the gnd voltage potential is greater than the voltage potential at terminals a on the r esistor, at terminal b on the transistor, the pn junction operates as a parasitic diode. in addition, the parasitic npn transistor is formed in said parasitic diode and the n layer of surrounding elements close to said parasitic diode. these parasitic elem ents are formed in the ic because of the voltage relation. the parasitic element operating causes the interference of circuit operation, then the wrong operation and destruction. therefore, please be careful so as not to operate the parasitic elements by i mpressing to input terminals lower voltage than gnd (p substrate). please do not apply the voltage to the input terminal when the power - supply voltage is not impressed. moreover, please impress each input terminal lower than the power - supply voltage or equ al to the specified range in the guaranteed voltage when the power - supply voltage is impressing. 13) earth wiring pattern if small signal gnd and large current gnd exist, disperse their pattern. in addition , for voltage change by pattern wi ring impedance and large current not to change voltage of small signal gnd, each ground terminal of ic must be connected at the one point on the set circuit board. as for gnd of external parts, it is similar to the above - mentioned. figure 2 8 . example of ic structure
22 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? ordering informatio n b d 8 2 6 6 e f v - m e 2 part number package efv: htssop - b24 packaging m: high reliability e2:embossed carrier tape (htssop - b24) ? physical dimension tape and reel information ? marking diagram (top view) htssop - b24 (top view) d 8 2 6 6 e f v part number marking lot number 1pin mark
23 / 23 tsz02201 - 0g1g0bk00070 - 1 - 2 ? 20 12 rohm co., ltd. all rights reserved. 17.aug.2016 rev.010 www.rohm.com tsz22111  15  001 b d8266efv - m ? revision history date revision changes 30.may.2012 001 new release 30.aug.2012 005 p age addition p6 - 7 electrical characteristic for - 40  to 85  p age addition p8 - 1 1 typical performance curve s p age addition p1 5 gain calculation revi s e ddition p1 typical application circuit reviced dition p2 pin description & block diagram reviceddition p4 term addition in electrical characteristic ( s ) reviceddition p 5 term addition in electrical characteristic ( s ) reviceddition reviceddition p1 2 additional table for driver logic opu p rotect ed operat ion reviceddition p1 2 vreg explanation reviceddition p1 3 - 1 4 constant symbol reviceddition p1 6 block diagram reviceddition p1 6 table addition for channel example and e x ternal constant reviceddition p1 7 power dissipation at 85  reviceddition p2 2 revision history re 8 . n ov .2012 006 revi s e i nput resistant (in1,in2 - 1,in2 - 2)21k  - > 20.75 k  revice i nput resistant (in3,in4)47k  - > 50k  p4,p6 symbol of bias in put current change vbd - >ibd p14 equation s unit change a c ha nge s ymbol
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd8266efv-m package htssop-b24 unit quantity 2000 minimum package quantity 2000 packing type taping constitution materials list inquiry rohs yes bd8266efv-m - web page distribution inventory


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